Semiconductor structure for mems device

ABSTRACT

The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure has a plurality of interconnect layers disposed within a dielectric structure over a substrate. A passivation layer is over the dielectric structure. A sensing electrode and a bonding electrode have bottom surfaces directly contacting the passivation layer. A microelectromechanical systems (MEMS) substrate is vertically separated from the sensing electrode. The bonding electrode is electrically connected to the MEMs substrate and to one or more of the plurality of interconnect layers. An electrode extension via is configured to electrically connect the sensing electrode to one or more of the plurality of interconnect layers.

REFERENCE TO RELATED APPLICATION

This Application is a Continuation of U.S. application Ser. No. 15/193,410, filed on Jun. 27, 2016, the contents of which are hereby incorporated by reference in their entirety.

BACKGROUND

Microelectromechanical systems, or MEMS, is a technology that integrates miniaturized mechanical and electro-mechanical elements on an integrated chip. MEMS devices are often made using micro-fabrication techniques. In recent years, MEMS devices have found a wide range of applications. For example, MEMS devices are found in hand held devices (e.g., accelerometers, gyroscopes, digital compasses), pressure sensors (e.g., crash sensors), micro-fluidic elements (e.g., valves, pumps), optical switches (e.g., mirrors), etc.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 illustrates a cross-sectional view of an embodiment of a disclosed semiconductor structure for a microelectromechanical system (MEMS) device.

FIG. 2 illustrates a cross-sectional view of an additional embodiment of a disclosed semiconductor structure for a MEMS device.

FIG. 3 illustrates a cross-sectional view of an additional embodiment of a disclosed semiconductor structure for a MEMS device.

FIGS. 4-11 illustrate cross-sectional views of some embodiments showing a method of forming a semiconductor structure for a MEMS device.

FIG. 12 illustrates an embodiment of a method associated with the disclosed semiconductor structure for a MEMS device.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

MEMS (microelectromechanical systems) devices often comprise a moveable, soft mechanical structure. The soft mechanical structure abuts a semiconductor structure having in a cavity that allows the soft mechanical structure to move freely. During operation of the MEMS device, external stimuli (e.g., pressure, acceleration, etc.) may operate upon the soft mechanical structure with a force that causes the soft mechanical structure to move within the cavity. As the soft mechanical structures moves, a capacitance between the soft mechanical structure and a sensing electrode changes. The change in capacitance allows for the external stimuli to be measured by the MEMS device. Because movement of the soft mechanical structure is based upon a pressure within the cavity, the accuracy of a MEMS device is based on the cavity having a predetermined pressure. However, a pressure within the cavity can be affected by out-gassing or by deviations from an expected dimension of the cavity.

Typically, sensing electrodes of a MEMs device are arranged within a BEOL metal stack and are exposed to a cavity by selectively etching the BEOL metal stack. However, it has been appreciated that etching the BEOL metal stack may also expose ILD layers within the BEOL metal stack to the cavity. The ILD layers may comprise materials that can outgas into the cavity, thereby changing a pressure of the cavity acting on the soft mechanical structure of the MEMS device. Furthermore, etching processes used to expose the sensing electrode are difficult to control. This difficulty in etch process control, may reduce an accuracy of the predetermined pressure (since the predetermined pressure is dependent upon a dimension of the cavity) and/or increase a distance between the soft mechanical structure and the sensing electrode.

The present disclosure relates to a method of forming a MEMS device, which forms electrodes over a BEOL stack using a deposition process. Because the electrodes are formed over the BEOL stack using a deposition process, etching of the BEOL stack is avoided, thereby mitigating out-gassing and allowing for improved control of electrode positions. Furthermore, in some embodiments, a passivation layer may be deposited to overly the BEOL stack, which acts to reduce outgassing by blocking outgassing from underlying layers.

FIG. 1 illustrates some embodiments of a cross-sectional view of a disclosed semiconductor structure for a MEMS device. The integrated chip 100 comprises a semiconductor structure 102 having a complementary metal oxide semiconductor (CMOS) substrate 104 with one or more transistor devices 106 disposed therein.

A back-end-of-line (BEOL) stack 108 is disposed over the CMOS substrate 104. The BEOL stack 108 is comprised of an interlayer dielectric (ILD) region 110 underlying an inter-metal dielectric (IMD) region 112. The ILD region 110 may comprise, for example, a low κ dielectric material or an oxide. The IMD region 112 includes a passivation layer 112 a overlying a stacked structure having dielectric layers 112 b (e.g., silicon dioxide) and etch stop layers 112 c (e.g., silicon nitride). In the stacked structure of the IMD region 112, dielectric layers 112 b and etch stop layers 112 c are stacked in an alternating fashion. In one embodiment, the passivation layer 112 a of the IMD region 112 is comprised of a passivation material configured to prevent outgas sing from the IMD region 112. The etch stop layers 112 c may also be comprised of the passivation material to prevent outgas sing from adjacent dielectric layers 112 b.

A plurality of metal layers, comprising metal wire layers 114 and vias 116, are disposed within the IMD region 112. In various embodiments, the metal wire layers 114 and the vias 116 are comprised of conductive materials, such as aluminum (Al), copper (Cu), tungsten (W), or combinations thereof. In one embodiment, the plurality of metal wire layers 114 increase in size as their distance from the CMOS substrate 104 increases. The metal wire layers 114 may be, for example, copper, aluminum copper, aluminum, tungsten, some other metal, or a combination of the foregoing.

A MEMS substrate 120 is arranged over the semiconductor structure 102. The MEMS substrate 120 comprises one or more MEMS devices (e.g., a pressure sensor, an accelerometer, a gyroscope, etc.) having malleable, soft mechanical structures, 122 a and 122 b. In some embodiments, the soft mechanical structures, 122 a and 122 b, comprise one or more openings 124 vertically extending through at least a portion of the MEMS substrate 120. The openings 124 allow for movement of the soft mechanical structures, 122 a and 122 b (e.g., causing the soft mechanical structures to act as a spring or diaphragm). In some embodiments, the one or more openings 124 are laterally offset from the soft mechanical structures 122 a and 122 b, to provide electrical isolation within the MEMS substrate 120. In other embodiments, the soft mechanical structures, 122 a and 122 b, may not have openings.

A carrier substrate 136 is disposed over the MEMS substrate 120. The carrier substrate 136 comprises one or more cavities, 138 a and 138 b, that are hermetically sealed. The cavities, 138 a and 138 b, are positioned between the semiconductor structure 102 and the MEMS substrate 120 and are arranged over the soft mechanical structures, 122 a and 122 b. The one or more cavities, 138 a and 138 b, allow the soft mechanical structures, 122 a and 122 b, to move freely within a controlled environment (e.g., pressure) of a respective cavity, 138 a or 138 b. In some embodiments, an anti-stiction stopper 128 may be disposed onto an exposed surface of the cavities, 138 a and/or 138 b, to prevent stiction between the soft mechanical structures, 122 a and 122 b, and the exposed surface of the cavities, 138 a and 138 b.

An electrode layer 118 is disposed over the passivation layer 112 a of the IMD region 112. The electrode layer 118 includes a plurality of electrodes including sensing electrodes, 118 a and 118 b, and bonding electrodes 118 c-118 f. The sensing electrodes 118 a and 118 b are electrically connected to metal wire layers 114 within the IMD region 112 by electrode extension vias 116 a and 116 b, respectively. The electrode extension vias 116 a and 116 b are disposed within the passivation layer 112 a of the IMD region 112. The passivation layer 112 a separates the one or more cavities, 138 a and 138 b, from the BEOL stack 108, thereby mitigating out-gassing from the ILD region 110 and the dielectric layers 112 b into the cavity, 138 a or 138 b. In some embodiments, the passivation layer 112 a and the sensing electrodes 118 a and 118 b completely cover the BEOL stack 108.

The soft mechanical structures, 122 a and 122 b, are arranged over the sensing electrodes, 118 a and 118 b. The vertical distances (i.e., height) between the sensing electrodes, 118 a and 118 b, and the corresponding soft mechanical structures, 122 a and 122 b are defined as sensing gaps, 126 a and 126 b. The smaller the sensing gap the more accurate the MEMS device. The sensing electrodes, 118 a and 118 b, may be configured to measure a variable capacitance caused by movement of the soft mechanical structures 122 a and 122 b in the cavities 138 a and 138 b. For example, the closer the sensing electrode 118 a is to the soft mechanical structure 122 a, the more sensitive the sensing electrode 118 a is to the variable capacitance caused by movement of the soft mechanical structure 122 a (i.e., since capacitance is inversely proportional to distance, a smaller distance will result in a measured capacitance changing by a larger amount in response to a stimuli). Because the sensing electrode 118 a and 118 b are arranged over the passivation layer 112 a, the sensing gaps, 126 a and 126 b, are not formed by etching the IMD region 112. Instead, the sensing gaps 126 a and 126 b are formed by a deposition process which can be more accurately controlled than an etch process.

A bonding structure 130 is disposed onto a first side of the semiconductor structure 102, facing the MEMS substrate 120. The bonding structure 130 includes the bonding electrodes 118 c, 118 d, 118 e, and 118 f of electrode layer 118, an electrically conductive layer 132, and a metalloid layer 134. The bonding electrodes 118 c, 118 d, 118 e, and 118 f are laterally offset from the one or more soft mechanical structures, 122 a and 122 b, and corresponding sensing electrodes 118 a and 118 b.

The electrically conductive layer 132 provides an electrical connection between the MEMS substrate 120 and the semiconductor structure 102. The electrically conductive layer 132 overlies the electrode layer 118. The metalloid layer 134 overlies the conductive layer 132. Together the electrode layer 118, the electrically conductive layer 132, and the metalloid layer 134 form a bond of the bonding structure 130. The bonding structure 130 is configured to form a hermetic seal that separates the one or more cavities, such as 138 a and/or 138 b, from an ambient environment. For example, the bonding structure 130 may form the sidewalls of the cavities 138 a and 138 b. A lower surface of the cavity is comprised of the passivation layer 112 a and a sensing electrode 118 a and/or 118 b. The passivation layer 112 a prevents outgassing into the cavities 138 a and 138 b. Furthermore, as described above, the sensing electrodes 118 a and 118 b are formed using deposition processes that allows for improved control over the sensing electrode 118 a and/or 118 b position and dimensions of the cavity 138 a and/or 138 b, which also affects the predetermined pressure of the cavities 138 a and 138 b.

FIG. 2 illustrates a cross-sectional view 200 of an additional embodiment of a disclosed semiconductor structure for a MEMS device. The semiconductor structure 102 comprises a BEOL stack 108 arranged over a CMOS substrate 104. In some embodiments, the BEOL stack 108 comprises one or more electrode extension vias, 116 a and 116 b, arranged within a passivation layer 112 a disposed over metal wire layers 114 of the BEOL stack 108. The one or more electrode extension vias, 116 a and 116 b, comprise tungsten. In some embodiments, the metal wire layers 114 may comprise copper or aluminum, so that the tungsten of the one or more electrode extension vias, 116 a and 116 b, is arranged over the copper or aluminum metal wire layers 114.

An electrode layer 118 is disposed over the passivation layer 112 a of the IMD region 112. The electrode layer comprises sensing electrodes 118 a-118 b arranged over the one or more electrode extension vias, 116 a and 116 b, and bonding electrodes 118 c-118 f. In some embodiments, the electrode layer 118 may comprise titanium, titanium nitride, titanium-tungsten, tantalum, and/or tantalum nitride. In other embodiments, the electrode layer 118 may comprise similar conductive materials. In some embodiments, the sensing electrodes 118 a-118 b may have angled sidewalls that cause a width of the sensing electrodes 118 a-118 b to decrease as a distance from the semiconductor structure 102 increases.

The semiconductor structure 102 is bonded to a MEMS substrate 120 by a bonding structure 130. The MEMS substrate 120 and the bonding structure 130 operate in a similar manner as described above with respect to FIG. 1. For example, as described above, the semiconductor structure 102 is connected to an overlying MEMS substrate 120 by way of the bonding structure 130. The bonding structure 130 extends from the MEMS substrate 120 to the passivation layer 112 a of the IMD region 112.

In some embodiments, the bonding structure 130 has a tapered profile that changes from a first width abutting the MEMS substrate 120 to a second width that is larger in a lower part of the bonding structure 130 adjacent the semiconductor structure 102. For example, the electrically conductive layer 132 is formed to overlie at least one of the bonding electrodes 118 c-118 f in the electrode layer 118. The electrically conductive layer 132 may be formed as a plurality of sections that have a width equal to or less than the width of the bonding electrodes 118 c-118 f. Likewise, the metalloid layer 134 may also be formed as a plurality of sections that have a width equal to or less than the width of the plurality of sections of the electrically conductive layer 132. In alternative embodiments, the electrically conductive layer 132 and/or the metalloid layer 134 form layers have widths larger than the width of a bonding electrode 118 a and/or 118 b.

As discussed above, the smaller the height of the sensing gap, the more sensitive the MEMS device is. The height of the sensing gaps 126 a and 126 b can be reduced by reducing the height of the bonding structure 130, which reduces the distance between the semiconductor structure 102 and the MEMS substrate 120. In some embodiments, there are openings in the MEMS substrate 120 adapted to recess the plurality of sections of the metalloid layer 134. Accordingly, the metalloid layer 134, and thus a portion of the bonding structure 130, is recessed in the MEMS substrate 120. This reduces the height of bonding structure 130, which consequently reduces the height of the sensing gaps 126 a and 126 b and allows the sensing electrodes 118 a and 118 b to be more sensitive to movements of the soft mechanical structures 122 a and 122 b.

The conductive layer 132 may comprise one or more of copper (Cu), tin (Sn), gold (Au), indium (In), titanium (Ti) or combination thereof. For example, the conductive layer 132 may comprise CuSn, AuSn, or AuIn. The conductive layer 132 may act as an adhesive layer to improve adhesion of the electrode layer 118 and the metalloid layer 134. In such embodiments, the bonding structure 130 may comprise a CuSn—Cu bond, a CuSn—CuSn bond, an AuSn—Au bond, or an AuIn—Au bond. Although the bonding layers shown herein are illustrated as separate bonding layers, the separate bonding layers may comprise atoms from other bonding layers (e.g., adjacent bonding layers), which diffuse during a bonding process. The metalloid layer 134 may be comprised of geranium (Ge).

A carrier layer 202 may be arranged between the MEMS substrate 120 and the carrier substrate 136. The carrier layer 202 includes a plurality of carrier sections. The carrier sections of the carrier layer 202 may be aligned with portions of the carrier substrate 136 offset by the cavities 138 a and 138 b. The carrier layer 202 may be, for example, a low κ dielectric or silicon dioxide, or a combination of low κ dielectric materials. A low-κ dielectric is a dielectric with a dielectric constant κ less than about 3.9. In an alternative embodiment, the carrier layer 202 is comprised of a passivation material such as silicon nitride.

FIG. 3 illustrates a cross-sectional view of some additional embodiments of a disclosed integrated chip 300 having MEMS devices. A carrier layer 302 is arranged and operates in a similar manner as the carrier layer 202 described above with respect to FIG. 2. A carrier layer 302 is arranged between the MEMS substrate 120 and the carrier substrate 136. However, the carrier layer 302 conforms to carrier substrate 136. For example, the carrier substrate 136 and the carrier layer 302 may together form the one or more cavities 138 a and 138 b arranged over the soft mechanical structures, 122 a and 122 b.

FIGS. 4-11 illustrate some embodiments of cross-sectional views showing a method of forming an integrated chip having MEMS devices.

FIG. 4 illustrates some embodiments of a cross-sectional view 400 of forming a semiconductor structure 102 for a MEMS device. In FIG. 4, an interlayer dielectric (ILD) region 110 is formed over a CMOS substrate 104. In one embodiment, the CMOS substrate 104 includes one or more transistor devices 106 disposed therein. The ILD region 110 may comprise, for example, a low κ dielectric or silicon dioxide.

In some embodiments, the CMOS substrate 104 can be a bulk silicon substrate or a semiconductor-on-insulator (SOI) substrate (e.g., silicon on insulator substrate) in the form of a disc-like wafer. The CMOS substrate 104 may also be a binary semiconductor substrate (e.g., GaAs), a tertiary semiconductor substrate (e.g., AlGaAs), a higher order semiconductor substrate, or even a sapphire substrate. The CMOS substrate 104 can include doped regions formed in or on the substrate, epitaxial layers formed in or on the substrate, insulating layers formed in or on the substrate, photoresist layers formed in or on the CMOS substrate 104, and/or conducting layers formed in or on the CMOS substrate 104. In many instances, the CMOS substrate 104, when in the form of a wafer, can have a diameter of 1-inch (25 mm); 2-inch (51 mm); 3-inch (76 mm); 4-inch (100 mm); 5-inch (130 mm) or 125 mm (4.9 inch); 150 mm (5.9 inch, usually referred to as a “6 inch”); 200 mm (7.9 inch, usually referred to as “8 inch”); 300 mm (11.8 inch, usually referred to as “12 inch”); or 450 mm (17.7 inch, usually referred to as “18 inch”); for example.

FIG. 5 illustrates some embodiments of a cross-sectional view 500 of forming a semiconductor structure 102 for a MEMS device. An inter-metal dielectric (IMD) region 112 is formed over the ILD region 110. The IMD region 112 includes a passivation layer 112 a overlying a stacked structure having dielectric layers 112 b (e.g., silicon dioxide) and etch stop layers 112 c (e.g., silicon nitride). In the stacked structure of the IMD region 112, dielectric layers 112 b and etch stop layers 112 c are stacked in an alternating fashion.

Metal layers are disposed within the stacked structure of the IMD region 112. The metal layers may comprise metal wire layers 114 or vias 116. Furthermore, the metal layers may be formed according to a single or dual damascene process. For example, in a dual damascene process, the layers of the IMD region 112 are deposited. Alternatively, the layers of the IMD region 112 may be grown on the CMOS substrate 104 using a thermal oxidation process (e.g., a wet thermal growth process or a dry thermal growth process) or using a deposition process (e.g., PVD, PE-CVD, CVD, etc.).

FIG. 6 illustrates some embodiments of a cross-sectional view 600 of forming a semiconductor structure 102 for a MEMS device. In FIG. 6, a mask 602 is formed over the passivation layer 112 a. The passivation layer 112 a is selectively patterned according to the mask 602 to form openings that expose a metal wire layer 114 of the IMD region 112. In another embodiment, one or more of the dielectric layers 112 b or etch stop layer 112 c is also patterned to expose a metal wire layer 114 of the IMD region 112. The patterning may include using photomask, hardmask, and/or resists to pattern the one or more layers of the stacked structure.

FIG. 7 illustrates some embodiments of a cross-sectional view 700 of forming a semiconductor structure 102 for a MEMS device. In FIG. 7, an electrode extension material is deposited on the etched stacked structure to form one or more electrode extension vias 116 a. In particular, the patterned openings are filled with the electrode extension material, which is in direct contact with an exposed metal wire layer 114. The electrode extension material is conductive and may be, for example, a metal, such as aluminum, copper, or tungsten, or a copper aluminum compound.

In one embodiment, the one or more electrode extension vias 116 a are formed using a damascene process. For example, the opening is first etched in the passivation layer 112 a. After the via hole is formed, a diffusion barrier layer and a seed layer are deposited within the openings. An electro chemical platting process is then used to fill the via with metal (e.g., copper) to form the vias 116.

FIG. 8 illustrates some embodiments of a cross-sectional view 800 of forming a semiconductor structure 102 for a MEMS device. In FIG. 8, the electrode extension material is planarized relative to the IMD region 112. In one embodiment, the electrode extension material is planarized using chemical mechanical planarization (CMP).

FIG. 9 illustrates some embodiments of a cross-sectional view 900 of forming a semiconductor structure 102 for a MEMS device. In FIG. 9, an electrode layer 118 is selectively deposited over the planarized IMD region 112. Because the electrode layer 118 is formed over the IMD region 112 using a deposition process, etching of the IMD region 112 to form the electrodes is avoided, thereby mitigating out-gassing from ILD layers within the IMD region 112.

In addition to the electrode layer 118, the electrically conductive layer 132, and a photoresist layer 902 are deposited. In some embodiments, the electrode layer 118 and the electrically conductive layer 132 may be deposited by way of a vapor deposition process (e.g., a CVD process, a PVD process, a PE-CVD process, etc.). Alternatively, the electrode layer 118 and the electrically conductive layer 132 may be formed by a plating process (e.g., an electroplating process, an electro-less plating process, etc.). The electrode layer 118 and the electrically conductive layer 132 may be patterned using photolithography of the photoresist layer 902. In some embodiments, the electrode layer 118 and the electrically conductive layer 132 may comprise one or more of copper (Cu), tin (Sn), gold (Au), indium (In), titanium (Ti), germanium (Ge), silicon (Si), or combinations thereof. In addition to the electrode layer 118, the electrically conductive layer 132, and the photoresist layer 902, the metalloid layer 134 may also be deposited

FIG. 10 illustrates some embodiments of a cross-sectional view 1000 of forming a semiconductor structure 102 for a MEMS device. In FIG. 10, the electrode layer 118, a conductive layer 132, and a photoresist layer 902, described above with respect to FIG. 9, are selectively wet etched to form one or more electrodes. Accordingly, as discussed above, the IMD region 112 is not etched to form the electrodes. Instead, the electrode layer 118 is deposited and etched to form the electrodes. As discussed above, plurality of electrodes may include multiple types of electrodes. For example, the plurality of electrodes may include sensing electrodes (e.g., 118 a and 118 b) and bonding electrodes (e.g., 118 c, 118 d, 118 e, and 1180.

FIG. 11 illustrates some embodiments of a cross-sectional view 1100 of forming a semiconductor structure 102 for a MEMS device. In FIG. 11, the semiconductor structure 102 is bonded to a MEMS substrate 120. The bonding forms one or more cavities overlying the one or more sensing electrodes. Although the one or more bonding layers (e.g., the electrode layer 118, the electrically conductive layer 132, and the metalloid layer 134) are shown as three layers, it will be appreciated that the one or more bonding layers may be a single bonding layer.

In some embodiments, the bonding structure 130 may comprise one or more materials that have a melting temperature of less than 400° C. to enable the low-temperature bonding process. In various embodiments, the low-temperature bond may comprise a eutectic bond or a solid-liquid interdiffusion bond (SLID). In some additional embodiments, the bonding structure 130 may also comprise an alloy have a relatively high melting temperature that enables a back-end-of-the-line packing process to be performed without melting the bonding structure 130. For example, in some embodiments, during bonding the plurality of bonding layers, including the bonding electrodes 118 c-118 f, the electrically conductive layer 132, and the metalloid layer 134, may form an intermetallic compound having a higher melting temperature than one or more of the plurality of bonding layers (e.g., a melting temperature of greater than or equal to approximately 300° C.).

FIG. 12 illustrates a flow diagram of some embodiments of a method 1200 of forming semiconductor structure for a MEMS device. While disclosed method 1200 is illustrated and described herein as a series of acts or events, it will be appreciated that the illustrated ordering of such acts or events are not to be interpreted in a limiting sense. For example, some acts may occur in different orders and/or concurrently with other acts or events apart from those illustrated and/or described herein. In addition, not all illustrated acts may be required to implement one or more aspects or embodiments of the description herein. Further, one or more of the acts depicted herein may be carried out in one or more separate acts and/or phases.

At 1202, an interlayer dielectric (ILD) region is formed over a substrate. In some embodiments, of act 1202 is associated with the cross-sectional view 400 of FIG. 4.

At 1204, an inter-metal dielectric (IMD) region is formed over the ILD region. In some embodiments, of act 1204 is associated with the cross-sectional view 500 of FIG. 5. The IMD region includes a passivation layer 112 a overlying a stacked structure having dielectric layers 112 b (e.g., silicon dioxide) and etch stop layers 112 c (e.g., silicon nitride). In the stacked structure of the IMD region 112, the dielectric layers 112 b and the etch stop layers 112 c are stacked in an alternating fashion. Metal layers are disposed within the stacked structure of the IMD region 112.

At 1206, one or more layers of the stacked structure are selectively patterned to expose a metal layer of the IMD region. The exposed metal wire layer may be an uppermost metal wire layer of the IMD region 112. In some embodiments, of act 1206 is associated with the cross-sectional view 600 of FIG. 6.

At 1208, an electrode extension material is deposited on the patterned stacked structure to form one or more electrode extension vias. In some embodiments, of act 1208 is associated with the cross-sectional view 700 of FIG. 7.

At 1210, planarization is performed to planarize the electrode extension material. In one embodiment, the planarization is performed using chemical mechanical planarization (CMP) techniques. In some embodiments, of act 1210 is associated with the cross-sectional view 800 of FIG. 8.

At 1212, an electrode layer is formed over the planarized stacked structure. In some embodiments, the electrode layer is formed using a vapor deposition technique, such as chemical vapor or physical vapor deposition, or atomic layer deposition. In some embodiments, of act 1212 is associated with the cross-sectional view 900 of FIG. 9.

At 1214, the electrode layer is selectively etched to form a plurality of electrodes. In some embodiments, of act 1214 is associated with the cross-sectional view 1000 of FIG. 10.

Electrodes of the plurality of electrodes are laterally separated from one another. For example, a first electrode of the plurality of electrodes is separated from a second electrode of the plurality of electrodes without an intervening layer between the electrodes. Furthermore, the plurality of electrodes may include multiple types of electrodes. For example, the plurality of electrodes may include sensing electrodes (e.g., 118 a and 118 b) and bonding electrodes (e.g., 118 c, 118 d, 118 e, and 1880. The different types of electrodes have different functions. For example, the sensing electrodes provide a sensing function for the MEMS device, and the bonding electrodes for a portion of a bonding structure.

At 1216, the semiconductor structure is bonded to a MEMS substrate. In some embodiments, of act 1216 is associated with the cross-sectional view 1100 of FIG. 11. In one embodiment, the CMOS structure is bonded to a MEMS substrate at one or more of the bonding electrodes to form the bonding structure.

Therefore, the present disclosure relates to a method of forming an integrated chip having one or more MEMS devices, and an associated apparatus. The stacked structure of the IMD region reduces the amount of outgassing that can occur from the semiconductor structure into the cavity. Accordingly, the pressure of the cavity can be more accurately maintained. The pressure in the cavity is also dependent on the dimensions of the cavity. During fabrication, the dimensions of the cavity can be more precisely controlled by depositing and etching the plurality of electrodes rather than etching the plurality of electrodes into the BEOL stack. More precisely controlling the dimensions allows the predetermined pressure in the cavity to be more accurately achieved. Furthermore, the deposition of the layers in the manner described reduces the height of the sensing gap, thereby making the associated MEMS device more sensitive.

In some embodiments, the present disclosure relates to a structure for a microelectromechanical systems (MEMS) device. The structure includes an interlayer dielectric (ILD) region positioned over a substrate. Further the structure includes an inter-metal dielectric region. The IMD region is comprised of a passivation layer overlying a stacked structure. The stacked structure includes dielectric layers and etch stop layers that are stacked in an alternating fashion. Metal wire layers are disposed within the stacked structure of the IMD region. The structure also includes a sensing electrode electrically connected to the IMD region with an electrode extension via. The structure includes a MEMS substrate comprising the MEMS device having a soft mechanical structure positioned adjacent to the sensing electrode.

In other embodiments, the present disclosure relates to a method of forming structure. An interlayer dielectric (ILD) region is formed over a CMOS substrate. An inter-metal dielectric (IMD) region is formed over the ILD region. The IMD region is comprised of a passivation layer overlying a stacked structure. The stacked structure includes dielectric layers and etch stop layers that are stacked in an alternating fashion. Metal wire layers are disposed within the stacked structure of the IMD region. The passivation layer is selectively patterned to expose a metal wire layer of the IMD region. An electrode extension material is deposited on the etched passivation layer to form one or more electrode extension vias. The electrode extension is material is planarized relative to the passivation layer. An electrode layer is selectively deposited on the IMD region and etched to form electrodes. The electrodes include sensing electrodes, positioned over the one or more electrode extension vias, and bonding electrodes. The semiconductor structure is then bonded to the MEMS substrate. The bonding is formed using the bonding electrodes. The bonding forms one or more cavities overlying the sensing electrodes.

In some embodiments, the present disclosure relates to structure for a microelectromechanical systems (MEMS) device. The semiconductor structure includes an interlayer dielectric (ILD) region positioned over a substrate. Further the semiconductor structure includes an inter-metal dielectric region. The IMD region is comprised of a passivation layer overlying a stacked structure. The stacked structure includes dielectric layers and etch stop layers that are stacked in an alternating fashion. Metal wire layers are disposed within the stacked structure of the IMD region. The semiconductor structure also includes a sensing electrode electrically connected to the IMD region with an electrode extension via. The sensing electrode is electrically connected to the IMD region with an electrode extension via. The sensing electrode is positioned adjacent the MEMS device such that a cavity is formed between the sensing electrode and the MEMS device.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. An integrated chip structure, comprising: a plurality of interconnect layers disposed within a dielectric structure over a substrate; a passivation layer over the dielectric structure; a sensing electrode and a bonding electrode having bottom surfaces directly contacting the passivation layer; a microelectromechanical systems (MEMS) substrate vertically separated from the sensing electrode, wherein the bonding electrode is electrically connected to the MEMs substrate and to one or more of the plurality of interconnect layers; and an electrode extension via configured to electrically connect the sensing electrode to one or more of the plurality of interconnect layers.
 2. The integrated chip structure of claim 1, wherein the passivation layer has a substantially planar upper surface that extends past opposing sidewalls of the sensing electrode and directly below the bonding electrode.
 3. The integrated chip structure of claim 1, wherein the bottom surfaces of the sensing electrode and the bonding electrode are separated from the substrate by distances that are approximately equal.
 4. The integrated chip structure of claim 1, wherein the bonding electrode has sidewalls defining a cavity disposed between the passivation layer and the MEMS substrate; and wherein the sensing electrode has an upper surface that further defines the cavity.
 5. The integrated chip structure of claim 4, further comprising: an electrically conductive layer arranged over the bonding electrode, wherein the electrically conductive layer has sidewalls further defining the cavity.
 6. The integrated chip structure of claim 1, wherein the passivation layer has a lower surface contacting an upper surface of the dielectric structure.
 7. The integrated chip structure of claim 1, wherein the pas sivation layer is separated from the substrate by the dielectric structure.
 8. The integrated chip structure of claim 1, wherein the plurality of interconnect layers comprise a conductive interconnect wire contacting lower surfaces of both the passivation layer and the electrode extension via.
 9. A microelectromechanical systems (MEMS) structure, comprising: a plurality of interconnect layers surrounded by a dielectric structure over a substrate; a sensing electrode electrically connected to the plurality of interconnect layers by an electrode extension via; a MEMS substrate disposed directly above and vertically separated from the sensing electrode; and a bonding structure electrically connected to the MEMS substrate and the plurality of interconnect layers, wherein the bonding structure is laterally separated from one or more sides of the sensing electrode by a non-zero gap along a horizontal line that is parallel to an upper surface of the dielectric structure.
 10. The MEMS structure of claim 9, wherein the plurality of interconnect layers comprise a conductive interconnect wire having an upper surface that contacts the electrode extension via and that laterally extends past one or more sidewalls of the electrode extension via.
 11. The MEMS structure of claim 10, wherein the conductive interconnect wire is arranged along the upper surface of the dielectric structure.
 12. The MEMS structure of claim 9, further comprising: a passivation layer disposed over the dielectric structure and laterally surrounding the electrode extension via, wherein the upper surface of the dielectric structure directly contacts a bottom surface of the passivation layer.
 13. The MEMS structure of claim 9, wherein the bonding structure has sidewalls defining a cavity disposed between the upper surface of the dielectric structure and the MEMS substrate; and wherein the sensing electrode is disposed within the cavity.
 14. The MEMS structure of claim 9, wherein the bonding structure vertically extends from a first position that is laterally separated from the sensing electrode by the horizontal line to a second position that is vertically above a top of the sensing electrode.
 15. The MEMS structure of claim 9, wherein the bonding structure comprises a bonding electrode and an overlying electrically conductive layer, the bonding electrode having a first height that is substantially equal to a second height of the sensing electrode.
 16. An integrated chip structure, comprising: a plurality of interconnect layers within a dielectric structure over a substrate; an electrode extension via arranged along a top of the dielectric structure over one of the plurality of interconnect layers; a sensing electrode contacting the electrode extension via; a bonding electrode that is vertically over the top of the dielectric structure and that is laterally separated from a sidewall of the sensing electrode, wherein bottommost surfaces of the sensing electrode and the bonding electrode are separated from the substrate by distances that are approximately equal; and a MEMS substrate electrically coupled to the bonding electrode and vertically separated from the sensing electrode.
 17. The integrated chip structure of claim 16, wherein the bonding electrode has a sidewall defining a cavity that is vertically separated from the substrate by the dielectric structure, wherein the cavity laterally surrounds the sensing electrode.
 18. The integrated chip structure of claim 16, further comprising: a passivation layer arranged between the dielectric structure and the bottommost surfaces of the sensing electrode and the bonding electrode.
 19. The integrated chip structure of claim 18, wherein the passivation layer directly contacts the dielectric structure directly below an outermost sidewall of the sensing electrode.
 20. The integrated chip structure of claim 18, wherein the passivation layer has a bottommost surface that is directly below an outermost sidewall of the sensing electrode. 